Investigation of the oxidation process at the copper-solder interface with atomic force microscopy

Attila Bonyar; Tamas Hurtony; Szabolcs David

doi:10.1109/SIITME.2012.6384400

Investigation of the oxidation process at the copper-solder interface with atomic force microscopy

Attila Bonyar^*
, Tamas Hurtony
, Szabolcs David

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

Abstract

In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.

Original language	English
Title of host publication	2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings
Pages	317-320
Number of pages	4
DOIs	https://doi.org/10.1109/SIITME.2012.6384400
Publication status	Published - 1 Dec 2012
Event	2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Alba Iulia Duration: 25 Oct 2012 → 28 Oct 2012

Conference

Conference	2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012
City	Alba Iulia
Period	25/10/12 → 28/10/12

Keywords

Atomic Force Microscope (AFM)
corrosion
intermetallic compounds

Access to Document

10.1109/SIITME.2012.6384400

Cite this

@inproceedings{a45000eeb81941d6899538e07e1e8d6c,

title = "Investigation of the oxidation process at the copper-solder interface with atomic force microscopy",

abstract = "In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.",

keywords = "Atomic Force Microscope (AFM), corrosion, intermetallic compounds",

author = "Attila Bonyar and Tamas Hurtony and Szabolcs David",

year = "2012",

month = dec,

day = "1",

doi = "10.1109/SIITME.2012.6384400",

language = "English",

isbn = "9781467347594",

pages = "317--320",

booktitle = "2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings",

note = "2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 ; Conference date: 25-10-2012 Through 28-10-2012",

}

Bonyar, A, Hurtony, T & David, S 2012, Investigation of the oxidation process at the copper-solder interface with atomic force microscopy. in 2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings., 6384400, pp. 317-320, 2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012, Alba Iulia, 25/10/12. https://doi.org/10.1109/SIITME.2012.6384400

Investigation of the oxidation process at the copper-solder interface with atomic force microscopy. / Bonyar, Attila; Hurtony, Tamas; David, Szabolcs.
2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings. 2012. p. 317-320 6384400.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Investigation of the oxidation process at the copper-solder interface with atomic force microscopy

AU - Bonyar, Attila

AU - Hurtony, Tamas

AU - David, Szabolcs

PY - 2012/12/1

Y1 - 2012/12/1

N2 - In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.

AB - In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.

KW - Atomic Force Microscope (AFM)

KW - corrosion

KW - intermetallic compounds

UR - https://www.scopus.com/pages/publications/84872385492

U2 - 10.1109/SIITME.2012.6384400

DO - 10.1109/SIITME.2012.6384400

M3 - Conference contribution

AN - SCOPUS:84872385492

SN - 9781467347594

SP - 317

EP - 320

BT - 2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings

T2 - 2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012

Y2 - 25 October 2012 through 28 October 2012

ER -

Investigation of the oxidation process at the copper-solder interface with atomic force microscopy

Abstract

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this